Description:
As our Engineering Manager/Director of Testing & Packaging, you’ll be a hands-on leader who thrives on innovation, teamwork, and rolling up your sleeves to build something extraordinary.
In this role, you will:
- Lead Testing & Packaging Operations: Oversee all aspects of laser chip testing and packaging, driving performance, yield, and reliability for cutting-edge products.
- Own Equipment Strategy & Setup: Work closely with the facility team to lead equipment installation, calibration, and layout planning—including support for ongoing cleanroom expansion.
- Optimize Processes: Improve throughput, automation, and efficiency across all testing and packaging stages, enabling scalable high-volume production.
- Build & Lead Your Team: Hire, train, and mentor engineers—including early-career talent with no prior semiconductor experience.
- Develop Future Leaders: Implement mentorship and growth pathways to develop junior engineers into industry experts.
- Collaborate Cross-Functionally: Align with design, QA, manufacturing, and facilities teams to bring new products and processes to life.
- Maintain Safety & Compliance: Ensure adherence to industry standards, safety protocols, and best practices.
- Stay on the Cutting Edge: Monitor industry trends and emerging tech to keep YST one step ahead.
Who You Are
- Experienced: 7+ years in semiconductor testing/packaging, including 3+ years with laser chips (DFB, EML).
- A Proven Leader: 3+ years managing engineering teams and technical projects.
- Technically Sharp: Strong hands-on experience with testing tools, wire/die bonding, optical coating, and process optimization.
- Startup-Ready: Comfortable in a fast-paced, dynamic environment where you’ll wear many hats and help shape infrastructure and team culture.
- A Great Collaborator: Able to work closely with both engineering and facilities teams to execute complex installations and lab upgrades.
- A Mentor at Heart: Committed to teaching and developing the next generation of engineers.