Principal Engineer

 

Description:


The role involves HBM architecture and analysis with modeling and development of high-speed interface, interposer, power distribution networks (PDN) partnering with IO design in next-generation HBM products. In this position, you will be responsible for the pathfinding , design analysis, development, design, optimization, and verification. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful.

Responsibilities Will Include, But Are Not Limited To
 

  • Analyze HBM cube PDN integration partnering with IO design
  • Pathfinding to explore new HBM architectures, interposer design and modeling for future HBM products and make recommendations after performing highly technical feasibility analyses
  • Develop the HBM PHY interface analysis with PDN integrated environment
  • Establish signal integrity and power integrity guidelines for end-to-end die to interposer to substrate level heterogenous integrated systems
  • Parasitic modeling and design validation, reticle experiments and required tape-out revisions
  • Maintain technical expertise and provide training
  • Contribute to cross group communication to work towards standardization and group success
  • Drive innovation into the future Memory generation with dynamic work environment
  • Work with HBM memory and IO design teams to ensure HBM product meet industry leading speed, power, cost, and quality metrics
     

Successful Candidates For This Position Will Have
 

  • Strong theoretical and practical knowledge in SI/PI/EMI
  • Extensive background in Signal and Power Integrity, with a focus on I/O circuit and signaling performance
  • Proficiency with simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS
  • Good knowledge of CMOS circuit design, device physics, analog and mixed-signal circuit with experience in high-speed link, ESD
  • Familiar with one or more off-chip protocols such as HBM, UCIe or other DRAM
  • Experience with circuit verification and optimization including layout verification and parasitic extractions of the circuits
  • Good understanding on timing/area/power/complexity tradeoffs on sophisticated interface design
  • Experience with interposer design and modeling such as CoWoS, EMIB, etc is preferred
  • Handy scripting languages, including Python, Tcl, Perl, ACE, and shell is a plus
  • Experience with industry-standard tools such as Cadence ADE, Spectre, AMS verification, EM/IR flows, MATLAB, Calibre, etc.
  • Understanding of device physics and basic CMOS processing techniques and BSIM model preferred
  • Excellent problem-solving and analytical skills
  • Strong communication skills with the ability to convey sophisticated technical concepts to other design peers both verbally and written
     

Required Experience
 

  • BSEE or greater
  • 7+ years of relevant technical expertise

Organization Micron Technology
Industry Engineering Jobs
Occupational Category Principal Engineer
Job Location Texas,USA
Shift Type Morning
Job Type Full Time
Gender No Preference
Career Level Experienced Professional
Experience 7 Years
Posted at 2025-04-16 11:30 am
Expires on 2026-01-13