Staff Product Engineer

Description:

Requires a Bachelor’s degree (or foreign equivalent) in Electrical Engineering, Electronic Engineering, or related field and 2 years of experience in product engineering, new product development, and customer electrical failure analysis for mixed signal products. Must have the following experience: Type-C device applications and test methodology; Digital and analog circuits, device physics and IC fabrication processes (Wafer Probe, Package Assembly & Test, Burn-In, System Level Tests); Product development process and all the device life cycles; Failure analysis, and electrical fault isolation and defect characterization tools and techniques such as the following: ATE, curve trace, micro-probing, light emission microscopy, CSAM, XRAY, FIB, SEM and deprocessing techniques; Reliability testing, product qualification, yield analysis, product characterization and yield improvement; Wafer level chip scale package technology FA methodology; Analyzing Statistical and Pareto to drive product performance improvements; and analyzing customer returns towards root cause identification and driving necessary containment, corrective, and preventative actions. Up to 5% domestic travel and 5% international travel required.