Failure Analysis Engineer

Description:

The main responsibility for this position is Fault Isolation of semiconductor IC devices to help determine root cause. Evaluates the electrical characteristics of systems and/or integrated circuits, components, and sub-components to help determine root cause of failure using Electrical fault isolation tools/techniques. Review of current and historical production, and quality data will be necessary as part of the investigation. High level of collaboration and interaction with different Product Engineering, Design Engineering, Quality Engineering, and Foundry Engineering teams is necessary. The qualified candidate will be working autonomously or at times within a team, to analyze design, reliability, or yield failures down to a root cause. This will involve use of various state-of-the-art analytical tools, processing the acquired data and information sets to arrive at a conclusion regarding the cause of failure. Ability to seamlessly work with cross-functional teams around the globe is a must.

Preferred Qualifications:

• Fundamental knowledge of Fault isolation techniques and hands on experience
• Advantest digital automatic test equipment (ATE) hands on experience
• Hands on Scan/ATPG/MBIST debug
• Sound theoretical knowledge of Digital/Analog CMOS circuits
• Experience with CAD layout tools

Hands on experience semiconductor IC Failure Analysis experience in:

• Structural debug (ATPG) for yield
• Fault isolation techniques: Emission Microscopy, LASER based stimulation techniques; LIVA/TIVA/CTM, Thermal emission, Curve tracer, X-ray imaging etc.,
• Tools/techniques that use Solid Immersion Lens (SIL)
• Hands on experience with Laser Voltage Probe (LVP), e-Beam system is a definite plus

• Required: Bachelor's, Electrical Engineering or Electronics and Communications
• Preferred: Master's, Electrical Engineering

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.